Shenzhen · Manufacturing since 2014
Precision PCBs, from first prototype to full production.
2 to 36 layers, HDI, high-frequency and rigid-flex — built in a 20,000 m² plant with 300 people behind it. Every quote starts with your files being read by the engineering team — not a template.
Send Gerbers — you'll hear back within one business day. No account, no minimum commitment.
From the line
Boards we've actually shipped
Photographed on our own benches — not renders, not stock images. The same lines that run a two-layer prototype run the thirty-six-layer test substrate.

2-layer power board

4-layer ENIG board

6-layer ENIG board

8-layer blind & buried via board

12-layer HDI board

36-layer IC test substrate
01 — Capabilities
What we build
Multilayer, HDI, high-frequency and rigid-flex all run in the same plant — so a board can move from a 2-layer prototype to a 36-layer build without changing supplier, or re-qualifying a new factory halfway through your program.
Multilayer FR-4
2 to 36 layers, samples through to repeat production.
- Shengyi · ITEQ · Nanya
- High-Tg, halogen-free, thick copper
- Impedance-controlled builds
HDI & blind/buried vias
1–3 stage builds for dense, fine-pitch designs.
- Laser-drilled microvias
- Up to 3-stage builds
- Resin plugging, via-in-pad
High-frequency & mixed dielectric
Rogers and Taconic, bonded to FR-4 where cost matters.
- RO4003C, RO4350B, RO3003, RO4835
- Taconic, IT180, PTFE, ceramic
- Hybrid, impedance-controlled
Rigid-flex & special processes
Rigid-flex, back-drilled and cavity builds, all built in-house.
- Rigid-flex and flex builds
- Castellated, back-drilled
- Metal edge plating, cavities
02 — Industries
Where our boards go to work
Boards for these markets ship every week. Tell us which one you're in and we'll quote the stack-up that matches it — not a one-size default.
Industrial control
PLCs, drives and controllers that run for years without a reboot. High-Tg materials and thick copper on request.
Automotive electronics
Lighting, sensors and body electronics — built for thermal cycling and disciplined quality documentation.
Telecom & RF
Impedance-controlled stack-ups, coupon-verified on every lot.
Medical devices
Reliability-first builds for monitoring and diagnostics, with lot traceability and paperwork on request.
Power supplies
Two-layer through multilayer power boards, heavy-copper options, HASL or ENIG as standard.
Test & measurement
Fixtures, load boards and jigs — the same lines that run our 36-layer IC test substrates.
Also regular: LED drivers · security & access control · consumer electronics · university and research builds.
03 — Why Reach
Your files get read by an engineer before they reach the drill
Most quality problems are designed in, not manufactured in. We review every order for drill-to-copper clearance, annular ring, solder mask dams and impedance feasibility — then tell you what we found, including the parts that will cost you money later.
- Free DFM report with every quoteClearance, annular ring, mask and silkscreen conflicts, flagged with the layer and coordinates.
- Materials you can auditBranded laminates and inks — Shengyi, ITEQ, Nanya, Taiyo, Guangxin — with lot traceability on request.
- 40 process stages, 113 in-process checksOperator self-check at each stage, QA patrol inspection, then 100% electrical test before packing.
- One contact from quote to shipmentThe person who quotes your board is the person who answers when it ships.
04 — How it works
Five steps, no black box
You always know which stage your boards are in. Quotes carry a firm lead time, and we tell you the same day if something slips.
Files & DFM
Send Gerbers, stack-up and quantity. Engineering reviews and returns a quote with a DFM report.
Tooling
CAM, fixturing and drilling programs. First-article confirmation before the line starts.
Imaging & plating
LDI exposure, pattern plating, etching and AOI at every inner layer.
Lamination & finish
Press, drilling, mask, surface finish — ENIG, HASL, immersion tin or silver, hard gold.
Test & ship
100% electrical test, final inspection, vacuum packing, DHL or FedEx with tracking.
Turnaround
Pick the lane that fits your build
Three typical service lanes. All times are fabrication time only — not the date the boards reach your door; add 3–5 days for express shipping. Lead times are confirmed per order after engineering reviews your files.
| Standard multilayer | Advanced | Specialty | |
|---|---|---|---|
| Typical build | 2–6 layer FR-4 control and power boards | 8–10 layers, impedance-controlled, heavy copper | HDI, Rogers / Taconic, rigid-flex — up to 36 layers |
| Prototype — fabrication time | 5–8 working days | ~15 working days | 18–25 working days |
| Production (500+) | 2–3 weeks | Quoted per build | Quoted per build |
| Surface finish | HASL or ENIG | ENIG standard; immersion silver / tin, hard gold optional | ENIG, ENEPIG, hard gold — set per process |
| Qualification | IPC-A-600 Class 2 | IPC-A-600 Class 2; Class 3 on request | Class 3 on request, with coupon and microsection reports |
| Best for | Industrial control, power supplies, IoT | Backplanes, high-speed digital, telecom | RF modules, wearables, medical and automotive builds |
05 — Quality
Tested board by board, not batch by batch
Every panel goes through electrical test and optical inspection. Prototype quantities get flying-probe testing; production runs get dedicated test fixtures so cycle time stays short without skipping coverage.
- 100% electrical testOpen/short testing on every board, with netlist comparison against your data.
- AOI on inner and outer layersFilm AOI plus post-etch and post-mask inspection.
- Coupon-based lab checksCopper thickness, coating thickness by X-ray, solderability, impedance coupons, microsection.
Start a build
Send your Gerbers. Get a quote and a DFM report back within one business day.
Prototypes from a handful of pieces, production runs to 50,000 m² a month. Tell us the application and we'll tell you honestly whether your stack-up is the right call.